Thermal Analysis Of An Electronic Package Using TAMS And TNETFA

A typical electronics package is verified using the lumped modeling methodology using the FORTRAN code TNETFA and TAMS available in academic literature. TAMS stand for Thermal Analyzer for Multilayer Structures (TAMS) and TNETFA stands for Transient Network Thermal Analyzer (TNETFA). Electronics packages constitute dissipation heat sources of components located on multi-layered boards (PCB). Protecting the components from thermal damage which comes from careful selection of layout, dissipation levels and thermal control methods. Code implementation, code verification, academic benchmarks and board level validations has been made to validate the applicability of TAMS and TNETFA codes for PCB thermal analysis. Results of the thermal analysis are compared with standard benchmarks in available literature. While considering the strong conduction and radiation modes under typical operating environments, improvements in the temperature levels of the PCB & Components were observed. Based on the results of thermal analysis changes are suggested to improve thermal performance of the electronic package. Keywords-TAMS, TNETFA, Electronic package, PCB, Chip, Lumped Modeling